Laser Diode Characterization System Model 58620

Key Features:

Download Datasheet

Double Sided Wafer Inspection System Model 7936

 Key Features:

Chroma 7936 double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.

Applied with high speed camera and inspection algorithms, Chroma 7936 can inspect a 2" LED wafer in 4.5 minutes; the throughput is about 35msec/ chip. Chroma 7936 also provides auto focus and warpage compensation function to overcome wafer warpage and chuck leveling issue. There are two magnifications for selection by applicable chip size or defect size. The minimum resolution of the system is 0.7um that has capability to detect 2 um defect size.

System Function 
After the tape expansion process , t h e arrangement of dies on wafer may be formed an irregular alignment. Chroma 7936 also offers software alignment function to adjust wafer alignment angle for scan. In addition, Chroma 7936 owns a friendly user interface to reduce user's learning time. All of inspection information is visualized for easy reading, like mapping map, defect region, inspection results.

Defect Analysis 
All of inspection result raw data are recorded not only pass/fail and bin data. This is easily to analysis an optimal parameter that achieves the balance overkill and underkill. The data also helps to monitor the defect trend caused by the production process, and feedback to production unit in advance.

In conclusion, Chroma 7936 is an ideal cost and performance selection for wafer chip inspection process.

Wafer Chip Inspection System - Model 7940

Key Features:

Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection. It is capable of inspecting both top and bottom view of the wafer chip simultaneously. Utilizing an advanced illumination technology and color camera acquisition, the system can be customized for various wafer processes and test configuration such as vertical chip or flip chip inspection.

With high-speed camera and inspection algorithms, Chroma 7940 can inspect up to 6" wafer in 3 minutes with a throughput of up to 15 msec./chip. It provides auto focus and compensation for wafer warpage and leveling of an uneven chuck. 
2X and 5X magnifications with 1.3μm/pixel and 0.5μm/pixel resolutions respectively are used to detect various defects down to 1.5μm in size.

System Function

After tape expansion, individual chip orientation may become irregular and chip realignment is needed during the inspection process. Chroma 7940 includes a software alignment function that automatically adjusts wafer alignment angle for precision scanning. The system comes with an easy-to-read and user-friendly interface that significantly reduces user's learning time while providing visual wafer mapping of defect regions and inspection result.

Defect Analysis

Besides pass/fail inspection and bin data, all raw data for the inspection result may be recorded for further analysis. This database makes it easy to analyze and obtain optimal parameters for balancing the over-kill and under-kill. It is also used to monitor defect trend caused by the production process, therefore capable of providing advanced feedback for production control.

Download Datasheet

Laser Diode Characterization System Model 58620

Key Features:

Download Datasheet

TO-CAN/CoC Burn In System - Model 58603

Key Features

Burn-in, Reliability & Life Test

The Chroma 58603 is a high density, multifunction, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 128 discrete channels which can source current and measure voltage in various control modes as described below.

Auto Current Control Mode (ACC)

In auto current control (ACC) mode, the control circuit will provide the preset current to each laser diode with high stability. No matter how the device resistance and temperature change, the current will be kept constant over the test period. The device voltage will be recorded as a quality reference parameter.

Auto Power Control Mode (APC)

With feedback signal from the optional external Photo Diode PCB, the control circuit can adjust the laser diode current automatically to keep constant feedback signal strength, which means the optical output of the laser diode is maintained constant over the test period. The device voltage and current are recorded as quality parameters for reference.

Temperature Control

A proprietary designed heat plat will control the laser diode case temperature with high accuracy, excellent stability, and good uniformity. Compared with oven or chamber types of laser diode burn-in systems, our solution is much more compact, easier to operate, better performance, and energy saving. Customers gain benefit for small footprint, versatile usage, and easy maintenance.

Individual Module Operation

Modules are mounted in a 19" rack to form a system. Each module is a 3U height drawer to fit in the rack. Customers can set different modules in different temperatures, operated in different control modes, and with different start and stop times. This provides great flexibility in operation.

Protection and Individual Channel Shotdown

The control circuit is specially designed for protecting laser diodes. No rush current or voltage will occur to hurt the devices. High/Low limits of current and voltage can be set to perform shutdown protection. When abnormality happens, only the particular channel will be shutdown while others are running normally. Besides the protection functions implemented in the control circuit, isolation and ESD protection are also taken care in system design.

Auto Data Recovery afterCommunication Interruption

The burn-in data are stored in system PC and optional remote servers. If the communication between the module and PC is broken temporarily, the data will be buffered in the module up to 8 hours or even longer. After the communication is restored, the buffered data will be dumped to the PC/server without loss.

Download Datasheet

TO-CAN Package Inspection System - Model 7925 

Key Features

Chroma 7925 is an automatic inspection system for TO-CAN package. The appearance defects over 30μm like lens scratch, partial are clearly conspicuous by using advanced illumination technology. Because the height variation of tray and package exists, Chroma 7925 can calculate the focus distance and compensate to overcome the variation with auto focus function.

User can edit his own defect criteria for versatile pass/fail rule setting and pick by the defect code. The whole machine process is automatic during load, inspection, pick to unload. It greatly reduces the opportunity of operator error and abnormal process. Engineer can get a detail inspection raw data and defect images. It is more helpful to analysis the process problem and increase the yield for using the data got from Chroma 7925.

TO-CAN DEFECT ITEMS