Plasma Etch

 

Omega® Etch Systems

SPTS offers advanced etch technologies for a wide range of applications within MEMS, Advanced Packaging, LEDs, high speed RF IC & power semiconductors.

Etch Technologies

 

 

Plasma Dicing

 

Mosaic™  System for Plasma Dicing

Plasma dicing, using Deep Reactive Ion Etching (DRIE) processing, is gaining rapid acceptance within the semiconductor industry as a viable alternative to conventional singulation methods using saw blades or LASERs.

Plasma dicing offers considerable benefits to users

  • Up to 80% more die per wafer, at higher throughput

  • Up to 100% stronger die at higher yields

  • Flexibility for die layout and design.

Plasma dicing can be carried out before grinding, where deep dicing lanes are etched into the wafer and the die are singulated by a final backside grind operation, or after grind where DRIE is used to etch through thinned wafers mounted on taped frames, or carriers.

Plasma dicing is compatible with solder bumps and backside metal, and the Mosaic™ plasma dicing solution has successfully demonstrated “dicing after grind” on standard/thinned/TAIKO wafers and wafer pieces, on a range of dicing frames and tapes.

Singulated Die Images:

The Mosaic™ platform with Rapier-S process modules, is as etch system, designed for plasma dicing of framed wafers up to 200mm, in volume production.  The larger Rapier-300S module is compatible with 300mm framed wafers.

  • Mosaic platform is based on the existing range of SPTS platforms for Omega, Sigma & Delta products.

  • Rapier-S/Rapier-300S systems are an evolution of the Rapier DRIE product line, bringing DRIE capability to framed substrates.

  • High throughputs are achieved with Rapier-S/Rapier-300S. The flexibility of the Bosch process provides ability to etch narrow, high aspect ratio lanes up to “full wafer thickness”.

SPTS’s Sentinel™ end-point detection system (patent-pending), detects the point at which the etch first reaches the dicing tape, and also any loss of active cooling during the process. At end-point, the process can be modified to complete the die separation without causing lateral damage of the die sidewall at the silicon/tape interface. This control ensures that die strength is improved compared to existing singulation methods. Use of endpoint detection also protects the tape, ensuring that singulated die can be safely handled and the tape frame re-used.

 

HF Release Etch

 

Primaxx® Etch Systems

SPTS offers the broadest range of dry HF vapor release products, from lab systems for research and development to multi-chambered cluster tools for high volume production. The industry leading Primaxx® HF vapor etch release technology is used to remove sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices.Our proprietary dry process avoids stiction of released moving parts and damage to delicate structures – common issues with conventional wet processing technology.Combining anhydrous HF vapor and alcohol vapor at reduced pressure and elevated temperature provides a wide, stable process window that can address different oxide compositions and thicknesses, while maintaining high selectivity to other common materials found in MEMS designs including exposed aluminum/alloy features such as mirrors and bondpads.

Product Range

 

 

XeF2 Release Etch

Xactix® XeF2 Release Etch Systems

Isotropic etching of silicon using xenon difluoride is an ideal solution for releasing MEMS devices. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. Being a vapor phase etchant, XeF2 avoids many of the problems typically associated with wet or plasma etch processes.

The CVE module has a unique chamber design which provides high etch rates, uniformity and efficiency. It is designed to fit on the SPTS cluster platforms allowing the integration of multiple XeF2 modules with the full line of modules available from SPTS.

 

1. e2

 

Key to successful research is process flexibility and the Xactix® e2™ provides the widest range of process options. Developed as the successor to the e1, the e2 retains ease of use, low cost of ownership and a small footprint, but adds additional options and even greater process flexibility.  The Xactix® e2™ is the ideal solution for those seeking a low cost, table-top R&D xenon difluoride etching system.

Key Benefits

  • Low cost, easy to use, and reliable
  • Great for working with small samples and wafers
  • Includes the etch unit, PC with keyboard and mouse, flat panel display, pump, and manual
  • New options to increase process flexibility
    • Increased selectivity to SiN and SiO2
    • Additional process gas can be added
  • Pulsed and optional continuous flow etch processes
  • Lower installation costs
  • Easy field upgrades with options

 

2. X4

 

The Xactix® X4 Series™ is the leading XeF2 etch system for releasing MEMS devices. Its accelerated etch rates and superior components make it ideal for applications from intensive R&D to pilot production.

Key Benefits

  • Equipped with our patented dual expansion chamber design for high etch rates
  • Allows for high XeF2 gas flow and pressure without dilution from carrier gases
  • Provides both pulsed and continuous flow etch processes
  • Unique expansion chamber based design contributes to precise, repeatable pulse pressure and ease of mixing XeF2 with other gases
  • Customizable chamber size can be matched to the wafer size resulting in maximized etch rates, uniformity and efficiency
  • Easy to use, reliable and safe

 

3. CVE

Key Benefits

  • Patented chamber design optimized for gas phase etching
  • Edge lift to protect delicate double sided wafers
  • Temperature controlled chuck with optional backside helium for improved etch rates, uniformity and selectivity
  • Easy conversion between 150 mm and 200 mm wafers
  • Ability to clamp a wide variety of substrate thicknesses
  • Wide range of wafer handling options
  • Transfer under vacuum from a wide variety of SPTS modules

Molecular Vapor Deposition (MVD®) Systems

MVD® replaces traditional liquid coating processes with a highly reproducible vapor deposition alternative that is ideal for manufacturing applications.

Typical MEMS devices benefiting from MVD® hydrophobic anti-stiction films include displays, sensors, actuators, RF switches, inkjets, and data storage devices. BioMEMS applications include wetting control in micro-fluidics (lab-on-a-chip, microplates), passivation on implantable devices, requiring biocompatible surface coatings, and devices requiring functionalized surface coatings.

MVD® is also used for commercial applications requiring moisture barriers, anti-corrosion coatings, or release layers for imprinting.

Product Range

 

 

Metal Deposition

 

Sigma® Deposition Systems

 

 

 

 

 

 

 

 

 

The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD 

Metal Deposition Technologies

  • Standard PVD – conventional sputter modules for low topography features

  • Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features

  • C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier

Advantages of SPTS PVD

  • Single wafer processing, improves yields and on-wafer performance, when compared to batch processing. 

  • Planar target with full face erosion

    • avoids re-sputtering, reduces particle contamination

    • improves target life

  • Rapid target change (<5mins), with common magnetron increases uptime

  • Reliable handling of fragile, thinned or bowed wafers

  • "Super Uniformity" option available for specialist applications

  • Multi-wafer degas to increase throughput for long (low temp) degas applications

  • Common software for 200mm and 300mm systems - ease of use

 

Inkjet Printing for IC

 

Orbotech Inkjet™ 600

The Orbotech Inkjet™ 600 is a dot-matrix additive printing technology based on inkjet. The system prints functional UV curable acrylic materials, enabling solutions for a variety of applications.  The printer can print on EMS, metals, PI, PBO, IC substrates and solder resist.

Typical applications are:

  • Package Marking
  • Underfill Dam
  • Isolating Layers

Advantages of Orbotech Inkjet™ 600

  • Best printing quality and system robustness with DotStream Pro Technology™
  • Fast and cost-effective solution to replace most conventional imaging methods
  • Patented and advanced features for registration, printing and curing on-the-fly

 

APCVD

 

Under agreement with SPP Technologies, Ltd., SPTS offers solutions for Atmospheric Pressure CVD of SiH4 or TEOS based dielectrics. These APCVD product line based on patented Watkins Johnson (WJ) linear injector technology enables precise, repeatable deposition of doped or undoped films with no transient film properties and uniform gap fill across the wafer.Wafer transport is via a self-cleaning belt conveyor enabling excellent system reliability with the lowest CoO for dielectric gap-fill.

Multiple platform options and available

  • WJ-999 - 3 process chambers for TEOS and hydride processes
  • WJ-1000 – 4 process chambers for TEOS and hydride processes
  • WJ-1500 - 4 chambers for TEOS processes only
Factory-certified system re-manufacturing is available for all systems and multiple upgrade options ensure product longevity and extendibility.

PECVD

Delta® Deposition Systems

SPTS's Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductors, and advanced packaging. 

Key Benefits

    • Wafer sizes from 75mm to 300mm

    • Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity

    • Up to 10 gas lines and optional on-board liquid delivery system

    • Mixed frequency plasma capability for stress tuning

    • Active platen cooling for critical, low temperature [<175°C] packaging applications

    • Single and multi-wafer preheat chamber options for de-gassing sensitive substrates

LPCVD / Diffusion

 

Under agreement with SPP Technologies, Ltd., SPTS offers a range of large batch vertical furnaces. We are able to offer both new and factory-certified re-manufactured systems as well as custom system conversions to meet specific engineering requirements. The production-proven vertical furnaces deliver superior process results, high productivity and the lowest cost of ownership (CoO).

Products:

1.AVP / RVP

The AVP/RVP vertical batch furnace delivers superior process results, the lowest cost of ownership (CoO) and leading flexibility for diffusion, oxidation and LPCVD applications.

Superior process results

  • Thermal control from 100 to >1200°C
  • Advanced injector technology for optimal gas distribution
  • Low O2 load lock maintains controlled wafer environment and ensures repeatability

Low cost of ownership

  • Single or dual-boat configuration
  • Dual-boat configuration eliminates wafer load/unload time
  • In-situ clean capability reduces CoO by up to 50%
  • Fast temperature ramp/cool option enables up to 30% reduction in process time

System flexibility

  • Run 150 and 200 mm simultaneously with no hardware changes
  • Compatible with perforated, bonded and ultra-thin substrates
  • Field conversion kits enable fast applications changes

2. RVP-300plus

The RVP-300plus vertical batch furnace is a flexible platform for diffusion, oxidation and LPCVD processes with leading productivity and low cost of ownership (CoO) on 200 and 300 mm wafers.

Process Flexibility

  • Runs 200 and 300 mm simultaneously with no hardware changes
  • Compatible with bonded, thin and bowed substrates
  • Modular hardware enables rapid system conversion for specific applications
  • Advanced across-flow chamber design for enhanced process control and reduced defects     

Excellent thermal control from 100 to >1200° Low Cost of Ownership

  • Dual-boat configuration eliminates wafer load/unload time
  • In-situ clean capability reduces CoO by up to 50%
  • Fast temperature ramp/cool option enables up to 30% reduction in process time
  • Factory certified remanufactured systems available
 

DSi, DSi-v & Rapier (for Si DRIE & related oxide etches)

With an installed base of over 1200 DRIE process modules, SPTS’s industry-leading position is spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

Advantages of SPTS Si DRIE

Delivering unparalleled process capability with world-class productivity & cost of ownership benefits, SPTS’s DRIE process modules are used in a wide variety of applications across multiple end markets.

 

ICP Etch (for III-Vs, GaN, SixNy & polymers)

The Omega® ICP process module uses a patented high density plasma source incorporating a radial coil design. The SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and metals. The ICP module is the industry leader for compound semiconductor applications.

Typical materials:

 

Synapse (for dielectric etch)

Omega® Synapse™ etch process module uses a high density plasma source and is designed to etch strongly bonded materials.

Advantages of Synapse

High MTBC - The process chamber can be heated to ~130ºC to reduce the amount of by-product deposition and improve MTBC. The chamber is also surrounded by permanent magnets which result in a higher plasma density than conventional ICPs (by a factor of ~10x).

High Etch Rate – Higher plasma density means higher etch rate of strongly bonded materials and the capability of running at reduced pressure. The latter extends mean free paths and leads to better directionality and less by-product ‘fencing’.

Versalis-compatible – Can be fully integrated with different SPTS etch and deposition modules on a Versalis cluster platform

Materials including…

uEtch

The uEtch is a single-wafer system specifically designed for university and small research laboratories.

Key Benefits

  • Fully integrated, compact system includes built-in HF gas cabinet
  • PLC controlled with multi-user features and extensive safety interlocks
  • Can process single whole wafers (100-200mm) or die on a carrier
  • HF vapor processes are transferable to SPTS 3- and 25-wafer production systems, offering a path from concept to production

Monarch 3

This compact module includes a three-wafer process chamber, and is designed for research laboratory and small volume production environments.
 

Key Benefits

  • An integrated Panel PC, with on-board electronics minimizes cleanroom footprint
  • Third generation process chamber has been designed for easy wafer size changes and maintenance
  • Wafer loading options include a semi-automatic 3-wafer loader with load lock, and various cluster-based configurations.

Monarch 25

The Monarch25 25-wafer batch process module is designed for medium to high volume HF release etch production applications in either the Primaxx®fxP or Primaxx® c2L configurations.

 

 

Key Benefits
  • High throughput, high uptime 25-wafer batch processing
  • Process chamber, gas/liquid panel, and pressure/vacuum components, all within a small footprint
  • Extensive process control and monitoring functions ensure the yield, reliability and repeatability required in volume production

Available configurations:

  • c2L supports up to 3 process modules
  • fxP supports up to 6 process modules
  • Versalis capability enables other SPTS modules to be added to either platform if required

Product Images:

Primaxx fxP HF etch cluster systemPrimaxx Monarch25 HF Etch Process Module

Monarch300

The Primaxx® Monarch300 is a fully integrated, automated VHF etch tool designed to perform selective MEMS etch release via a controlled anhydrous HF/Alcohol etch process. The process provides a vapor phase, isotropic etch of sacrificial oxide to release a flexure or other device. No liquids are used in contact with these MEMS devices and therefore “stiction” creating conditions are avoided. A clean, residue-free release etch is accomplished without liquids or supercritical drying.

Key Benefits

  • Compatible with 200mm & 300mm wafers
  • High throughput, high uptime 13-wafer batch processing
  • Process chamber, gas/liquid panel, and pressure/vacuum components, all within a small footprint
  • Extensive process control and monitoring functions ensure the yield, reliability and repeatability required in volume production

Available configurations:

  • fxP supports up to 6 process modules
  • Versalis capability enables other SPTS modules to be added to either platform if required

MVD100E

Typical MEMS devices benefiting from MVD® hydrophobic anti-stiction films include, sensors, actuators, displays, RF switches, inkjets, and data storage devices. BioMEMS applications include wetting control in micro-fluidics (labon-a-chip, microplates), passivation on implantable devices requiring biocompatible surface coatings, and devices requiring functionalized surface coatings (genome sequencing, diagnostics).

MVD® is finding increasing use in production applications requiring moisture barriers, anticorrosion coatings, or release layers for imprinting.

The MVD100E is the designated tool for R&D or pilot manufacturing. It is designed for high performance, flexibility and reliability for the most demanding applications. Corporate and Academic Research Labs have called it their most versatile and reliable piece of equipment.

Features and Benefits

  • Single substrate or small batch processing
    • 200mm wafers
    • Components on trays or racks
    • Small chamber volume for fast processing
    • Top-opening for ease of maintenance and cleaning
  • Superior Cost of Ownership – low consumption and efficient utilization of precursors
  • Integrated plasma surface treatment and chamber clean capability
  • Automated process sequence routines
  • Extensive self-diagnostic and data logging capability
  • Exceptional reliability
  • MVD and ALD-capable

MVD300 / MVD300E

Molecular Vapor Deposition (MVD®) is a highly reproducible vapor deposition alternative that is ideal for manufacturing applications.

Typical MEMS devices benefiting from MVD®) hydrophobic antistiction films include sensors, actuators, displays. RF switches, inkjets, and data storage devices. BioMEMS applications include wetting control in micro-fluidics (lab-on-a-chip, microplates), passivation on implantable devices — requiring biocompatible surface coatings, and devices requiring functionalized surface coatings (genome sequencing diagnostics).

MVD® is finding increasing use in production applications requiring moisture barriers, anti-corrosion coatings, or release layers for imprinting.

The MVD300® (and MVD300E with an EFEM) are designed for high performance, flexibility and reliability for the most demanding high volume manufacturing applications.

Features and Benefits

  • Batch processing for high throughput and small footprint
    • 200mm wafers (Pod loader or EFEM available)
    • 300mm wafers (EFEM enabled)
    • Singulated die on tape frames
    • Components on trays
    • Custom substrate fixturing available
  • Superior Cost of Ownership – low consumption and efficient utilization of precursors
  • Up to 4 Precursors
  • Integrated plasma surface treatment and chamber clean capability
  • Automated process sequence routines
  • Extensive self-diagnostic and data logging capability
  • Exceptional reliability
  • MVD and ALD-capable

MVD4500

Molecular Vapor Deposition (MVD®) is a highly reproducible vapor deposition alternative that is ideal for manufacturing applications.

Typical MEMS devices benefiting from MVD® hydrophobic antistiction films include, sensors, actuators, displays, RF switches, inkjets, and data storage devices. BioMEMS applications include wetting control in micro-fluidics (lab-on-a-chip, microplates), passivation on implantable devices requiring biocompatible surface coatings, and devices requiring functionalized surface coatings (genome sequencing, diagnostics).

MVD® is finding increasing use in production applications requiring moisture barriers, anti-corrosion coatings, or release layers for imprinting.

The MVD4500 is our panel and large substrate tool. It is capable of handling multiple substrates with sizes up to 930 x 720 mm. It is the only batch process tool capable of performing ALD and MVD on substrates in this size range. It is designed for high performance, flexibility and reliability for the most demanding high volume manufacturing applications.

Features and Benefits

  • Batch processing for high throughput and small footprint
    • Gen 4.5 substrates standard – glass, polymer sheets, metals
    • Capable of handling all substrate sizes below as well
    • Components on trays or racks
    • Custom substrate fixturing available
  • Two tools can stack for optimal footprint
    • Switchable GUI/Keyboard for ease of operator use
  • Superior Cost of Ownership – low consumption and efficient utilization of precursors
  • Up to 4 Precursors
  • Integrated plasma surface treatment and chamber clean capability
  • Automated process sequence routines
  • Extensive self-diagnostic and data logging capability
  • Exceptional reliability
  • MVD and ALD-capable